The effect of shear stress on the piezoresistance of silicon

Yan Wang, Min-Hang Bao, Lian-Zhong Yu
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引用次数: 11

Abstract

General analyses of the piezoresistance, taking into consideration the effect of shear stress, have been made for circular, square and rectangular silicon diaphragms. The analyses can lead to the design of a full-bridge pressure transducer on a (110) circular diaphragm with 30% higher sensitivity than previous designs. Experimental results showing the dependence of the piezoresistive sensitivity on the inclination angle agree well with the results of general analyses. Experiments show that the information obtained might also be useful in a new application where the non-linearity of transverse voltage of a four-terminal resistor can be compensated for by its own piezoresistive sensitivity of resistance.

剪切应力对硅抗压性能的影响
考虑剪切应力的影响,对圆形、方形和矩形硅膜片的压阻进行了一般分析。这些分析可以导致在(110)圆膜片上设计全桥压力传感器,其灵敏度比以前的设计高30%。实验结果表明,压阻灵敏度与倾角的关系与一般分析结果吻合较好。实验表明,所获得的信息在四端电阻器横向电压的非线性可以通过电阻本身的压阻灵敏度来补偿的新应用中也很有用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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