Analysis of the impact of vias on resonant rotary traveling wave oscillators

Javier Osorio Figueroa, M. L. Aranda
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引用次数: 0

Abstract

Rotatory traveling wave oscillator (RTWO) is an innovative technique for gigahertz rate clock signal generation and distribution. However, the increment of metal levels in current manufacturing technologies also increases the parasitic elements of vertical interconnections (vias), leading to a degradation in the integrity of the signal of the RTWO. In this work the analysis and quantification of undesirable effects introduced by vias are presented. Simulations were performed using the simulation tools HFSS (high frequency structural simulator) and Mentor Graphics, for different technologies (350, 180 and 130nm). The simulation results of RTWO oscillators show a degradation in frequency response above 1GHz when the effect of the vias is considered and the RTWO is operating at 30GHz. In this way is verified that the performance of RTWO systems is affected by the vertical interconnections.
通孔对旋转行波谐振器的影响分析
旋转行波振荡器(RTWO)是一种用于千兆赫时钟信号产生和分布的创新技术。然而,当前制造技术中金属含量的增加也增加了垂直互连(过孔)的寄生元件,导致RTWO信号完整性的降低。在本工作中,介绍了通过引入不良影响的分析和量化。利用HFSS(高频结构模拟器)和Mentor Graphics仿真工具对不同工艺(350、180和130nm)进行了仿真。仿真结果表明,考虑过孔的影响,当RTWO工作在30GHz时,RTWO振荡器的频率响应在1GHz以上有所下降。从而验证了垂直互连对RTWO系统性能的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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