Trends in low power digital system-on-chip designs

R. Saleh, G. Lim, T. Kadowaki, K. Uchiyama
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引用次数: 21

Abstract

A study of the future trends in low-power System-on-Chip (SoC) designs is presented, based on the recently announced ITRS-2001 technology characteristics for both high-performance and low-power devices from 2001 to 2016. We forecast the logic/memory composition of a reference low-power PDA design with an area constraint of 1 cm/sup 2/ using both a bottom-up, power dissipation-constrained chip model and a top-down, design resource-constrained model. Together, these analyses indicate that without accelerated improvements in both chip design productivity and leakage power management, future SoC designs will be comprised of 80-90% memory, with the remaining logic blocks composed of special-purpose reusable IP cores, and a smaller fraction of the chip containing newly designed logic.
低功耗数字片上系统设计的趋势
基于最近公布的ITRS-2001技术特征,从2001年到2016年,对低功耗片上系统(SoC)设计的未来趋势进行了研究。我们使用自底向上、功耗受限的芯片模型和自顶向下、设计资源受限的模型,预测了一个面积约束为1 cm/sup /的参考低功耗PDA设计的逻辑/内存组成。总之,这些分析表明,如果芯片设计效率和泄漏电源管理没有加速改进,未来的SoC设计将由80-90%的内存组成,剩余的逻辑块由专用可重用IP核组成,芯片中包含新设计逻辑的一小部分。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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