Direct bonding: retrospect and outlook

Abstract

The characteristic features of direct bonding with respect to its many-sided aspects are briefly enumerated. Nowadays silicon-on-silicon and silicon-on-insulator are the trendsetters. The preparative conditions of direct bonding are compatible with silicon technologies. In addition, in the future, direct bonding may find dedicated applications in the field of hybrid material combinations, micromechanics for precision medical tools, sensors and actuators.