Effect of high temperature storage on fan-out wafer level package strength

Abstract

Fan-out wafer level packaging technology becomes attractive because of its flexibility for integration of diverse devices in a small form factor. In this study, the effect of high temperature storage test on fan-out wafer level package strength was evaluated. There were three different structure fan-out wafer level packages. The high temperature storage reliability test was used to store the specimens up to 1000 hours. The three-point bending test method was conducted to evaluate the specimen flexure strength. The experiment results showed that FOWLP flexure strength increased with the high temperature storage test time increasing.