Test and verification of micro coaxial line power performance

Abstract

This paper presents the characterization of rectangular micro-coaxial transmission lines assembled in a high power test system. In addition to straight transmission lines, vertical solder transitions between stacked layers of rectangular coax are presented. These test assemblies utilize standard integration techniques and components: wire bond and flip-chip transitions and edge coaxial connectors. Assembled coax lines were tested at continuous wave power levels as high as 200 W at a frequency of 2 GHz. High frequency performance of the test assemblies is maintained throughout high power testing. Thermal models developed using a 3-D finite element method are utilized to understand limitations of micro-coaxial transmission lines at higher frequencies.