Automatic production test separating system of ASIC with package ID detection

Xiao Jun, Yi Wenshuang, Zhang Yuming, Yang Xiaoqiang, Huang Cheng, Ye Da
{"title":"Automatic production test separating system of ASIC with package ID detection","authors":"Xiao Jun, Yi Wenshuang, Zhang Yuming, Yang Xiaoqiang, Huang Cheng, Ye Da","doi":"10.1109/ICEPT47577.2019.245269","DOIUrl":null,"url":null,"abstract":"With the continuous development of IC (Integrated Circuit) technology, it has been widely used in all aspects of manufacture, production, consumption and so on, and IC filter as an important part of its production testing is directly related to the quality of IC, and with the wide application of automatic separating system of IC, production testing efficiency and quality was improved greatly. Domestic and international industrial separating systems are mainly developed for mass production and are suitable for civilian products in a single package. Due to its special requirements such as small batch size, multiple varieties, and data traceability, the research institutes ASIC(application-speciflc integrated circuit) is difficult to directly use industrial separating system. At the present time, package ID(identification) number was mainly detected by the naked eye and manual separating method was basically used in China. Therefore, there are many disadvantages such as low efficiency, error-prone, high cost, and the influence of human factors on the quality of IC.Due to the characteristics of the research institutes ASIC production, there are a large number of problems in product separating. In order to improve the production test efficiency and ensure the product quality, an automatic production test separating system of ASIC with package ID number detection has been developed. The system is based on the architecture of the embedded system platform and is mainly composed of the upper computer, the lower computer and the mechanical implementation. First of all, the upper computer software is implemented by the Virtual Basic language in the Virtual Studio platform. Secondly, The lower computer is based on the STM32F407IGH6 of ARM7 architecture, and is implemented by μC/OS III embedded OS(operating system) for mechanical part controlling and host computer interaction. At last, the mechanical part guarantees the test separating of different types of IC through high-magnification cameras, highresolution servo motors and high-precision screw mechanisms. Specially the package ID number detection system is implemented the detection algorithm through the NI-VDM module.Practical application has proved that the system is very stable and reliable, which greatly facilitates the detection of package ID number of IC, greatly reduces or avoids the occurrence of ASIC quality problems, greatly improves the efficiency of production testing, greatly meet the requirements of production, and has far-reaching practical significance.","PeriodicalId":6676,"journal":{"name":"2019 20th International Conference on Electronic Packaging Technology(ICEPT)","volume":"62 2 1","pages":"1-4"},"PeriodicalIF":0.0000,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 20th International Conference on Electronic Packaging Technology(ICEPT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT47577.2019.245269","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

With the continuous development of IC (Integrated Circuit) technology, it has been widely used in all aspects of manufacture, production, consumption and so on, and IC filter as an important part of its production testing is directly related to the quality of IC, and with the wide application of automatic separating system of IC, production testing efficiency and quality was improved greatly. Domestic and international industrial separating systems are mainly developed for mass production and are suitable for civilian products in a single package. Due to its special requirements such as small batch size, multiple varieties, and data traceability, the research institutes ASIC(application-speciflc integrated circuit) is difficult to directly use industrial separating system. At the present time, package ID(identification) number was mainly detected by the naked eye and manual separating method was basically used in China. Therefore, there are many disadvantages such as low efficiency, error-prone, high cost, and the influence of human factors on the quality of IC.Due to the characteristics of the research institutes ASIC production, there are a large number of problems in product separating. In order to improve the production test efficiency and ensure the product quality, an automatic production test separating system of ASIC with package ID number detection has been developed. The system is based on the architecture of the embedded system platform and is mainly composed of the upper computer, the lower computer and the mechanical implementation. First of all, the upper computer software is implemented by the Virtual Basic language in the Virtual Studio platform. Secondly, The lower computer is based on the STM32F407IGH6 of ARM7 architecture, and is implemented by μC/OS III embedded OS(operating system) for mechanical part controlling and host computer interaction. At last, the mechanical part guarantees the test separating of different types of IC through high-magnification cameras, highresolution servo motors and high-precision screw mechanisms. Specially the package ID number detection system is implemented the detection algorithm through the NI-VDM module.Practical application has proved that the system is very stable and reliable, which greatly facilitates the detection of package ID number of IC, greatly reduces or avoids the occurrence of ASIC quality problems, greatly improves the efficiency of production testing, greatly meet the requirements of production, and has far-reaching practical significance.
带封装ID检测的ASIC自动生产测试分离系统
随着IC (Integrated Circuit)技术的不断发展,已广泛应用于制造、生产、消费等各个方面,而IC滤波器作为其生产检测的重要组成部分,直接关系到IC的质量,而随着IC自动分离系统的广泛应用,生产检测效率和质量得到了极大的提高。国内外工业分离系统主要是为大批量生产而开发的,适用于单一包装的民用产品。由于其批量小、品种多、数据可追溯等特殊要求,科研院所专用集成电路(ASIC)难以直接应用于工业分离系统。目前国内主要以肉眼检测包裹ID(识别)号为主,基本采用人工分离方法。因此,存在着效率低、易出错、成本高、人为因素影响集成电路质量等诸多弊端。由于科研院所ASIC生产的特点,在产品分离方面存在着大量的问题。为了提高生产测试效率,保证产品质量,开发了一种具有封装ID号检测功能的ASIC自动生产测试分离系统。该系统基于嵌入式系统平台架构,主要由上位机、下位机和机械实现三部分组成。首先,上位机软件在Virtual Studio平台上使用Virtual Basic语言实现。其次,下位机基于ARM7架构的STM32F407IGH6,采用μC/OS III嵌入式操作系统实现机械部件控制和上位机交互。最后,机械部分通过高倍率摄像头、高分辨率伺服电机和高精度螺杆机构保证不同类型IC的测试分离。具体来说,包裹ID号检测系统是通过NI-VDM模块实现检测算法的。实际应用证明,该系统非常稳定可靠,极大地方便了IC封装ID号的检测,极大地减少或避免了ASIC质量问题的发生,极大地提高了生产检测的效率,极大地满足了生产的要求,具有深远的实际意义。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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