Correlation between microstructure and electrical properties of tungsten-silica nanocomposites

Nanostructured Materials Pub Date : 1999-10-01 DOI:10.1016/S0965-9773(99)00388-8

Tamar Tepper , Shlomo Berger

{"title":"Correlation between microstructure and electrical properties of tungsten-silica nanocomposites","authors":"Tamar Tepper , Shlomo Berger","doi":"10.1016/S0965-9773(99)00388-8","DOIUrl":null,"url":null,"abstract":"<div><p>The electrical properties and the microstructure of nanocomposite materials composed of nano-sized amorphous silica powder and micron-sized tungsten powder were studied as a function of composition and heat treatment temperature. The dielectric constant and the electrical conductivity of the nanocomposites are higher than those of pure silica powder at all compositions. The percolation threshold of this system is about 20% vol. W. Above this composition a sharp increase in the dielectric constant and in the electrical conductivity occurs. This increase becomes even sharper after the nanocomposites are heat treated at 950°C for 1 hour. No changes in the microstructure are observed up to this temperature. It is suggested that the electrical properties of the nanocomposites are dominated mainly by dangling bonds at the W/SiO<sub>2</sub> interfaces. Further research should be undertaken to investigate the factors controlling the dielectric constant and the electrical conductivity in order to obtain high capacitance materials with high dielectric constant and low electrical conductivity.</p></div>","PeriodicalId":18878,"journal":{"name":"Nanostructured Materials","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"1999-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1016/S0965-9773(99)00388-8","citationCount":"9","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Nanostructured Materials","FirstCategoryId":"1085","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0965977399003888","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 9

Abstract

The electrical properties and the microstructure of nanocomposite materials composed of nano-sized amorphous silica powder and micron-sized tungsten powder were studied as a function of composition and heat treatment temperature. The dielectric constant and the electrical conductivity of the nanocomposites are higher than those of pure silica powder at all compositions. The percolation threshold of this system is about 20% vol. W. Above this composition a sharp increase in the dielectric constant and in the electrical conductivity occurs. This increase becomes even sharper after the nanocomposites are heat treated at 950°C for 1 hour. No changes in the microstructure are observed up to this temperature. It is suggested that the electrical properties of the nanocomposites are dominated mainly by dangling bonds at the W/SiO₂ interfaces. Further research should be undertaken to investigate the factors controlling the dielectric constant and the electrical conductivity in order to obtain high capacitance materials with high dielectric constant and low electrical conductivity.

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钨-二氧化硅纳米复合材料微观结构与电性能的关系

研究了由纳米非晶硅粉和微米级钨粉组成的纳米复合材料的电学性能和微观结构与材料成分和热处理温度的关系。纳米复合材料的介电常数和电导率均高于纯硅粉。该体系的渗透阈值约为20% vol. w，在此组合物之上，介电常数和电导率急剧增加。纳米复合材料在950°C下热处理1小时后，这种增加变得更加明显。在此温度以下，显微结构没有变化。结果表明，纳米复合材料的电学性能主要受W/SiO2界面悬垂键的影响。为了获得高介电常数、低电导率的高电容材料，需要进一步研究控制介电常数和电导率的因素。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Nanostructured Materials

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