Reliability aware dynamic voltage and frequency scaling for improved microprocessor lifetime

Naga Pavan Kumar Gorti, Arun Kumar Somani
{"title":"Reliability aware dynamic voltage and frequency scaling for improved microprocessor lifetime","authors":"Naga Pavan Kumar Gorti, Arun Kumar Somani","doi":"10.1145/2553070.2553073","DOIUrl":null,"url":null,"abstract":"Dynamic voltage and frequency scaling (DVFS) is heavily used for power management in real-time environments. Although the schemes leveraging DVFS provide significant power reduction, adverse effects on chip reliability are possible. Alternate increase and decrease in operating voltage and frequency leads to thermal cycling. Increasing transistor packing density leads to a larger range of possible operating temperatures, exacerbating the thermal cycling problem. Also, the chip reliability quantification process does not include and represent the effects of small scale thermal cycles. A good number of in-field chip failures are attributed to the consequences of these. Thus, it is imperative to include their effects into the processor voltage and frequency selection process. Our work develops an integrated processor thermal and performance management technique centered on novel polynomial time scheduling algorithms that lead to lowering of thermal cycles in soft real time environments. Our technique leverages application awareness and runtime monitoring for improving chip lifetime, while achieving considerable energy savings. We show that a significant reduction in thermal cycles and peaks is possible, leading to longer chip life expectations.","PeriodicalId":7046,"journal":{"name":"ACM SIGOPS Oper. Syst. Rev.","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2013-11-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACM SIGOPS Oper. Syst. Rev.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/2553070.2553073","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

Abstract

Dynamic voltage and frequency scaling (DVFS) is heavily used for power management in real-time environments. Although the schemes leveraging DVFS provide significant power reduction, adverse effects on chip reliability are possible. Alternate increase and decrease in operating voltage and frequency leads to thermal cycling. Increasing transistor packing density leads to a larger range of possible operating temperatures, exacerbating the thermal cycling problem. Also, the chip reliability quantification process does not include and represent the effects of small scale thermal cycles. A good number of in-field chip failures are attributed to the consequences of these. Thus, it is imperative to include their effects into the processor voltage and frequency selection process. Our work develops an integrated processor thermal and performance management technique centered on novel polynomial time scheduling algorithms that lead to lowering of thermal cycles in soft real time environments. Our technique leverages application awareness and runtime monitoring for improving chip lifetime, while achieving considerable energy savings. We show that a significant reduction in thermal cycles and peaks is possible, leading to longer chip life expectations.
提高微处理器寿命的动态电压和频率可调可靠性
动态电压和频率缩放(DVFS)被广泛用于实时环境中的电源管理。虽然利用DVFS的方案提供了显著的功耗降低,但对芯片可靠性的不利影响是可能的。工作电压和频率的交替增减导致热循环。增加晶体管封装密度导致更大的可能工作温度范围,加剧了热循环问题。此外,芯片可靠性的量化过程不包括和代表小规模热循环的影响。许多现场芯片故障都归因于这些后果。因此,必须在处理器电压和频率选择过程中考虑它们的影响。我们的工作开发了一种集成的处理器热和性能管理技术,该技术以新颖的多项式时间调度算法为中心,可降低软实时环境中的热循环。我们的技术利用应用程序感知和运行时监控来提高芯片寿命,同时实现相当大的能源节约。我们表明,热循环和峰值的显著减少是可能的,从而导致更长的芯片寿命预期。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信