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Best Paper Award: The effect of a threshold failure time and bimodal behavior on the electromigration lifetime of copper interconnects

2000 IEEE International Reliability Physics Symposium Proceedings. 38th Annual (Cat. No.00CH37059) Pub Date : 2011-04-10 DOI:10.1109/IRPS.2011.5784438
Ronald G. Filippi, Ping-Chuan Wang, A. Brendler, Paul S. McLaughlin, J. Poulin, B. Redder, James R. Lloyd, James J. Demarest
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引用次数: 24
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2000 IEEE International Reliability Physics Symposium Proceedings. 38th Annual (Cat. No.00CH37059)
2000 IEEE International Reliability Physics Symposium Proceedings. 38th Annual (Cat. No.00CH37059)
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