Optimization and innovative design of dental implants under dynamic finite element analysis

IF 1 4区 工程技术 Q3 ENGINEERING, MULTIDISCIPLINARY
Danang Yudistiro, Yung-Chang Cheng
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引用次数: 0

Abstract

ABSTRACT Dental implants’ usage life and strength are critical factors for implant patients. This paper examines the optimization of dental implant threads by modifying the C-Tech implant system model to ascertain thread design’s impact on micromotion through finite element analysis (FEA). The fundamental measurements of the redesigned C-Tech implant system are established by dynamic (FEA). Six implant parameters are chosen as the control factors to be advanced. Experimental simulations are built using a uniform design (UD) method. The dynamic FEA tool ANSYS/LS-DYNA is utilized for each experimental simulation to identify the maximal micromotion in the modified C-Tech implant system. The optimum design model is acquired by minimizing the micromotion by applying the Kriging interpolation (KGI) and genetic algorithm (GA). The improved design has a micromotion of 12.19 µm, as opposed to the original design’s micromotion of 38.11 µm. The improvement rate is 68.02%. Finally, the following innovative design is to add a secondary thread to the implant body. After conducting simulations, the micromotion is reduced to 4.72 µm. Further, it shows a 61.28% improvement compared with the optimization design version and an 87.62% improvement compared with the primary implants.
基于动态有限元分析的牙种植体优化与创新设计
种植体的使用寿命和强度是影响种植患者健康的关键因素。本文通过修改C-Tech种植体系统模型,对种植体螺纹进行优化设计,通过有限元分析确定螺纹设计对微动的影响。重新设计的C-Tech植入系统的基本测量是通过动态(FEA)建立的。选择了六个种植体参数作为控制因素。采用均匀设计(UD)方法进行了实验模拟。利用动态有限元分析工具ANSYS/LS-DYNA进行每次实验模拟,以确定改良C-Tech种植体系统的最大微运动。采用Kriging插值和遗传算法对微运动进行最小化,得到了最优设计模型。改进设计的微动为12.19µm,而原始设计的微动为38.11µm。改进率为68.02%。最后,接下来的创新设计是在种植体上增加一根次级螺纹。经过仿真,微动减小到4.72µm。与优化设计版本相比,提高了61.28%,与初级种植体相比提高了87.62%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Journal of the Chinese Institute of Engineers
Journal of the Chinese Institute of Engineers 工程技术-工程:综合
CiteScore
2.30
自引率
9.10%
发文量
57
审稿时长
6.8 months
期刊介绍: Encompassing a wide range of engineering disciplines and industrial applications, JCIE includes the following topics: 1.Chemical engineering 2.Civil engineering 3.Computer engineering 4.Electrical engineering 5.Electronics 6.Mechanical engineering and fields related to the above.
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