{"title":"High Speed ASIC Architectures for Aggregate Signature over BLS12-381","authors":"Kaoru Masada, R. Nakayama, M. Ikeda","doi":"10.1587/transele.2022lhs0001","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":13259,"journal":{"name":"IEICE Trans. Electron.","volume":"18 1","pages":"331-334"},"PeriodicalIF":0.0000,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEICE Trans. Electron.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1587/transele.2022lhs0001","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
