The Influence of the Molecular Weight of Polysulphone on the Adhesion of Epoxy/Polysulphone Binders to Fibres:

Abstract

The concentration dependences of the adhesive strength, τ, of joints of 150 μm diameter steel wire and modified epoxy binder were investigated. The modifier used was PSK-1 polysulphone of different molecular weight, M. The concentration, C, of PSK-1 was varied from 5 to 20 wt%. It was shown that the form of the τ-C curves changes with change in M. At M = 5000 and 10 000, τ is not dependent on C; at M = 17 000 and 27 000, the τ-C relationship is described by a curve with a maximum. At M = 35 000 and 42 000, the adhesive strength decreases with increase in C. The factors affecting the measured value of τ in the case of epoxides modified with heat-resistant thermoplastics are considered.