Mechanical Stress Simulation of Thin Film Transistor on Flexible Substrate

Abstract

The mechanical stress in a thin-film transistor on flexible substrate is the most important problem in display industry. It causes to change electrical performance when bending, stretching, and other possible mechanical deformation stress are applied to film stack, or when repeated deformation is performed to thin film device on flexible substrate. There are few literatures to describe the mechanical stress calculation based on analytic calculation when bending moment is quite small and substrate is larger than film thickness, but this approach has a limitation to extend mechanically large deformed device on a flexible substrate. This motivates us to develop a comprehensive numerical stress model for simulating thin film transistor device on flexible substrate.