Research on Novel Thermal Insulation Structure of CMOS-MEMS Thermopile

IF 1.3 Q3 COMPUTER SCIENCE, INFORMATION SYSTEMS

IET Networks Pub Date : 2022-10-14 DOI:10.1109/IET-ICETA56553.2022.9971595

Kai-Chung Yu, Chih-Hsiung Shen

引用次数: 0

Abstract

In this research, we discuss and analyze the thermal insulation microstructure which appropriately reduce the thermal conductivity and form a local channel where the heat flow is concentrated. As the channel becomes smaller, the thermal resistance increases and the noise will also increase. For the Johnson noise, the bandwidth can be reduced through subsequent electronic circuit signal processing. Although the response speed is sacrificed, the overall thermal sensing signal is improved in practical applications without introducing additional noise.

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CMOS-MEMS热电堆新型保温结构研究

在本研究中，我们讨论和分析了适当降低导热系数并形成热流集中的局部通道的隔热微观结构。随着通道变小，热阻增大，噪声也随之增大。对于约翰逊噪声，可以通过后续的电子电路信号处理来降低带宽。虽然牺牲了响应速度，但在实际应用中，在不引入额外噪声的情况下，整体热传感信号得到了改善。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IET Networks COMPUTER SCIENCE, INFORMATION SYSTEMS-

CiteScore

5.00

自引率

0.00%

发文量

审稿时长

33 weeks

期刊介绍： IET Networks covers the fundamental developments and advancing methodologies to achieve higher performance, optimized and dependable future networks. IET Networks is particularly interested in new ideas and superior solutions to the known and arising technological development bottlenecks at all levels of networking such as topologies, protocols, routing, relaying and resource-allocation for more efficient and more reliable provision of network services. Topics include, but are not limited to: Network Architecture, Design and Planning, Network Protocol, Software, Analysis, Simulation and Experiment, Network Technologies, Applications and Services, Network Security, Operation and Management.