Emerging NVM: A Survey on Architectural Integration and Research Challenges

Jalil Boukhobza, S. Rubini, Renhai Chen, Z. Shao
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引用次数: 102

Abstract

There has been a surge of interest in Non-Volatile Memory (NVM) in recent years. With many advantages, such as density and power consumption, NVM is carving out a place in the memory hierarchy and may eventually change our view of computer architecture. Many NVMs have emerged, such as Magnetoresistive random access memory (MRAM), Phase Change random access memory (PCM), Resistive random access memory (ReRAM), and Ferroelectric random access memory (FeRAM), each with its own peculiar properties and specific challenges. The scientific community has carried out a substantial amount of work on integrating those technologies in the memory hierarchy. As many companies are announcing the imminent mass production of NVMs, we think that it is time to have a step back and discuss the body of literature related to NVM integration. This article surveys state-of-the-art work on integrating NVM into the memory hierarchy. Specially, we introduce the four types of NVM, namely, MRAM, PCM, ReRAM, and FeRAM, and investigate different ways of integrating them into the memory hierarchy from the horizontal or vertical perspectives. Here, horizontal integration means that the new memory is placed at the same level as an existing one, while vertical integration means that the new memory is interleaved between two existing levels. In addition, we describe challenges and opportunities with each NVM technique.
新兴的NVM:建筑集成与研究挑战综述
近年来,人们对非易失性存储器(NVM)的兴趣激增。NVM有许多优点,例如密度和功耗,它在内存层次结构中占有一席之地,并可能最终改变我们对计算机体系结构的看法。许多nvm已经出现,例如磁阻随机存取存储器(MRAM),相变随机存取存储器(PCM),电阻随机存取存储器(ReRAM)和铁电随机存取存储器(FeRAM),每种都有其独特的特性和特定的挑战。科学界已经开展了大量的工作,将这些技术整合到记忆层次结构中。由于许多公司都宣布即将大规模生产NVM,我们认为是时候退一步讨论与NVM集成相关的文献了。本文概述了将NVM集成到内存层次结构中的最新工作。特别地,我们介绍了四种类型的NVM,即MRAM, PCM, ReRAM和FeRAM,并从水平或垂直的角度研究了将它们集成到存储器层次结构中的不同方法。在这里,水平集成意味着新内存与现有内存位于同一级别,而垂直集成意味着新内存在两个现有级别之间交错。此外,我们还描述了每种NVM技术的挑战和机遇。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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