A 9.02mW CNN-stereo-based real-time 3D hand-gesture recognition processor for smart mobile devices

Sungpill Choi, Jinsu Lee, K. Lee, H. Yoo
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引用次数: 30

Abstract

Recently, 3D hand-gesture recognition (HGR) has become an important feature in smart mobile devices, such as head-mounted displays (HMDs) or smartphones for AR/VR applications. A 3D HGR system in Fig. 13.4.1 enables users to interact with virtual 3D objects using depth sensing and hand tracking. However, a previous 3D HGR system, such as Hololens [1], utilized a power consuming time-of-flight (ToF) depth sensor (>2W) limiting 3D HGR operation to less than 3 hours. Even though stereo matching was used instead of ToF for depth sensing with low power consumption [2], it could not provide interaction with virtual 3D objects because depth information was used only for hand segmentation. The HGR-based UI system in smart mobile devices, such as HMDs, must be low power consumption (<10mW), while maintaining real-time operation (<33.3ms). A convolutional neural network (CNN) can be adopted to enhance the accuracy of the low-power stereo matching. The CNN-based HGR system comprises two 6-layer CNNs (stereo) without any pooling layers to preserve geometrical information and an iterative-closest-point/particle-swarm optimization-based (ICP-PSO) hand tracking to acquire 3D coordinates of a user's fingertips and palm from the hand depth. The CNN learns the skin color and texture to detect the hand accurately, comparable to ToF, in the low-power stereo matching system irrespective of variations in external conditions [3]. However, it requires >1000 more MAC operations than previous feature-based stereo depth sensing, which is difficult in real-time with a mobile CPU, and therefore, a dedicated low-power CNN-based stereo matching SoC is required.
面向智能移动设备的9.02mW基于cnn立体的实时3D手势识别处理器
最近,3D手势识别(HGR)已经成为智能移动设备的一个重要功能,例如头戴式显示器(hmd)或用于AR/VR应用的智能手机。图13.4.1中的3D HGR系统使用户能够使用深度传感和手部跟踪与虚拟3D对象进行交互。然而,之前的3D HGR系统,如Hololens[1],使用了一个耗电的飞行时间(ToF)深度传感器(>2W),将3D HGR的运行时间限制在3小时以内。虽然采用立体匹配代替ToF进行低功耗深度感测[2],但由于深度信息仅用于手部分割,无法提供与虚拟3D物体的交互。在智能移动设备(如头戴式显示器)中,基于hgr的UI系统必须是低功耗的(比以前基于特征的立体深度感测多1000次MAC操作),这在移动CPU上难以实时实现,因此需要一个专用的低功耗基于cnn的立体匹配SoC。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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