High-density monolithic 6×30 Gb/s tunable WDM transmitter in generic III-V platform

Abstract

We present the design and measurement of a high-density WDM transmitter from a simple, low-cost generic photonic foundry. Monolithic integration of active and passive devices on InP yields a compact circuit with 20 nm tuneability and 30 Gb/s modulation per channel. This results in a chip supporting 180 Gb/s with a high capacity density of 10 Gb/s/mm2.