Molecular Simulation-based Hardness Calculation of Graphene-reinforced Copper-tungsten Alloy Contacts

Hanwen Ren, Zhiyun Han, Qingmin Li, Mengxi Wang, Haoxi Cong
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Abstract

Copper-tungsten (CuW) alloy has been widely used in the contacts of circuit breaker. With the rapid development of power system to higher voltage levels, the existing contact material shows extremely deficient wear resistance, which is usually characterized by hardness property. In this paper, the models of CuW80 and CuW80Gr with different graphene contents are established. Then, the nanoindentation is used to calculate the material hardness, based on which the effect of graphene is discussed. Simulation results indicate that the addition of graphene can enhance the hardness of CuW alloy composites, and the hardness will decrease with graphene content. The indentation hardness of CuW80Gr with a graphene content of 0.037wt% reaches 13.16 GPa, which improves by 63% compared to CuW80 model. The research results in this paper can guide the design and modification of the contact material of circuit breaker.
基于分子模拟的石墨烯增强铜钨合金触点硬度计算
铜钨合金广泛应用于断路器触头中。随着电力系统向高电压水平的快速发展,现有的触点材料的耐磨性非常不足,通常以硬度为特征。本文建立了不同石墨烯含量的CuW80和CuW80Gr的模型。然后,利用纳米压痕计算材料硬度,在此基础上讨论了石墨烯对材料硬度的影响。仿真结果表明,石墨烯的加入可以提高CuW合金复合材料的硬度,硬度随石墨烯含量的增加而降低。石墨烯含量为0.037wt%时,CuW80Gr的压痕硬度达到13.16 GPa,比CuW80模型提高了63%。本文的研究成果对断路器触头材料的设计和改进具有指导意义。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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