The effect of CdTe deposition temperature on device properties of different TCOs and glass substrates

R. Dhere, M. Bonnet-eymard, Emilie Charlet, E. Peter, J. Duenow, H. Moutinho, Jian V. Li, M. Scott, D. Albin, T. Gessert
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引用次数: 3

Abstract

In this paper, we present our work on devices fabricated using CdTe films deposited by close-spaced sublimation using substrate temperatures in the range of 450° to 620° C. We studied devices prepared on Saint-Gobain soda lime SGG Diamant and Corning 7059 borosilicate glass substrates. We used four types of contact: SnO2:F, ITO, CTO, and Saint-Gobain AZO with and without high-resistivity buffer layers. We used a variety of buffer layers: undoped SnO2, zinc tin oxide (ZTO), and proprietary Saint-Gobain buffer layers. A buffer layer is crucial for devices using CTO and AZO as the front contact. For AZO layers developed by Saint-Gobain, we achieved 9% efficiency without a buffer layer and over 12% efficiency using buffer layers when CdTe films are deposited below 500° C. We used standard current density-voltage and quantum efficiency analysis to determine the device parameters.
CdTe沉积温度对不同tco和玻璃基板器件性能的影响
在本文中,我们介绍了我们在衬底温度范围为450°至620°c的近间隔升华沉积的CdTe薄膜制备器件的工作。我们研究了在圣戈班钠石灰SGG钻石和康宁7059硼硅酸盐玻璃衬底上制备的器件。我们使用了四种类型的触点:SnO2:F, ITO, CTO和Saint-Gobain AZO,有和没有高电阻率缓冲层。我们使用了多种缓冲层:未掺杂的SnO2,氧化锌锡(ZTO)和专有的Saint-Gobain缓冲层。缓冲层对于使用CTO和AZO作为前触点的器件至关重要。对于圣戈班开发的AZO层,我们在没有缓冲层的情况下实现了9%的效率,当CdTe膜沉积在500℃以下时,我们实现了超过12%的效率。我们使用标准电流密度电压和量子效率分析来确定器件参数。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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