The Study of the Influence on Heat Dissipation Effectiveness of the Pin-Fin Angle and Spacing in a Liquid Cooling Module

Abstract

This research discusses the thermal influence of the pin-fin angle and spacing of a liquid cooling module, and uses CFD simulation software for validation. When the pin-fin angle was increased, the junction temperature became higher. Although the junction temperature rose slowly, it was still above the maximum operating junction temperature of an IGBT module. Furthermore, when the pin-fin spacing was increased from 1mm to 8mm, the junction temperature rose at a faster rate. Therefore, the results from this study suggest that the pin-fin angle should be, or close to, 0° (perpendicular to fluid flow direction) and the spacing between pin-fins should be as small as possible when designing liquid cooling thermal dissipation module.