Towards wireless single chip systems: challenges for RF integration in SoC

S. Raman
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引用次数: 1

Abstract

The corresponding explosive growth in wireless communications systems has led to an increased demand for wireless devices which are compact, low-cost, and low-power. To meet this demand, IC which combine RF, analog, and digital functions on the same chip are required, rapidly approaching system-on-chip (SoC) implementations.
迈向无线单芯片系统:SoC中射频集成的挑战
无线通信系统的爆炸性增长导致对紧凑、低成本和低功耗的无线设备的需求增加。为了满足这一需求,需要在同一芯片上结合RF,模拟和数字功能的IC,迅速接近片上系统(SoC)的实现。
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