Design, simulation and modelling of LTCC based micro hotplate for gas sensor applications

Abstract

Low temperature co-fired ceramics (LTCC)-technology, which is widely used for packaging and manufacturing high frequency RF components, is used for fabrication of micro-hotplates (MHP). Gas sensors produced using this technology leads to low power consumption (500 mW for 226 °C) due to low thermal conductivity (3–4 W/(m-K)). For small series, this technology is remarkably inexpensive compared to the expensive silicon technology. Thermal properties such as temperature distribution and power consumption have been investigated using FEM (Finite Element Method) simulations. Mathematical modeling of these hotplates is also done in accordance with the simulated results.