Process, Voltage, and Temperature Aware Analysis of ISCAS C17 Benchmark Circuit

Suruchi Sharma, Santosh Kumar, A. Mishra, D. Vaithiyanathan, B. Kaur
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Abstract

High leakage currents such as sub-threshold leakage, junction leakage, and gate leakage currents have become prominent sources of power consumption in CMOS VLSI circuits due to rapid technology scaling in the nanometer regimen accompanied by supply voltage reduction. Consequently, in the nanometer regime, it is imperative to estimate and reduce leakage capacity. However, this continuous aggressive scaling makes the CMOS circuits more prone to Process, Voltage, and Temperature (PVT) variations at nanometer technologies. This paper explores a systematic analysis of various leakage power reduction techniques at the circuit level, such as Power Gating (PG), Drain Gating (DG), LECTOR and GALEOR, and analyzes the effect of PVT variations on the dissipation and delay of leakage power using the ISCAS C17 benchmark circuit.
ISCAS C17基准电路的工艺、电压和温度感知分析
高泄漏电流,如亚阈值泄漏、结泄漏和栅极泄漏电流已成为CMOS VLSI电路中主要的功耗来源,这是由于纳米技术的快速规模化以及电源电压的降低。因此,在纳米范围内,估计和减少泄漏容量是必要的。然而,这种持续的侵略性缩放使得CMOS电路在纳米技术下更容易受到工艺、电压和温度(PVT)变化的影响。本文系统分析了功率门控(PG)、漏极门控(DG)、漏极门控(LECTOR)和GALEOR等多种电路级的降低漏功率技术,并利用ISCAS C17基准电路分析了PVT变化对漏功率耗散和延迟的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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