Corrugated microstructures for silicon photodetectors

Abstract

In order to decrease the dark current of a pn junction photodetector together with improving its photoelectric response, thinning of a silicon wafer can be achieved without losing its mechanical resistance by a special etching process performed on both sides of the wafer. Corrugated microstructures were obtained by photolithographic and anisotropic etching procedures on silicon wafers meant to be used in photodetecting devices and optical measurements were performed.