A numerical analysis of the effects of the packing of microstrip devices with photonic bandgap technique

Twenty Seventh International Conference on Infrared and Millimeter Waves Pub Date : 2002-12-16 DOI:10.1109/ICIMW.2002.1076192

Zhiyuan Yu, Weigan Lin

引用次数: 0

Abstract

A numerical analysis is presented by the finite difference time domain method in this paper. A microstrip with an asymmetric metal bandgap structure which shows an extra-wide stop band is numerically analysed when its package is changed.

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光子带隙技术对微带器件封装效果的数值分析

本文采用时域有限差分法进行了数值分析。本文对一种具有非对称金属带隙结构的微带进行了数值分析，该微带具有超宽阻带。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Twenty Seventh International Conference on Infrared and Millimeter Waves

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