A numerical analysis of the effects of the packing of microstrip devices with photonic bandgap technique

Zhiyuan Yu, Weigan Lin
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Abstract

A numerical analysis is presented by the finite difference time domain method in this paper. A microstrip with an asymmetric metal bandgap structure which shows an extra-wide stop band is numerically analysed when its package is changed.
光子带隙技术对微带器件封装效果的数值分析
本文采用时域有限差分法进行了数值分析。本文对一种具有非对称金属带隙结构的微带进行了数值分析,该微带具有超宽阻带。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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