Study of V-groove on Leadframe/Epoxy Mold Compound Delamination Improvement

Abstract

The design of packages with high performance while maintaining the highest possible reliability is a challenge. To design reliable packages, understanding all possible failure modes as possible is becoming a key. Delamination is still a potential concern on product reliability, especially delamination at leadframe and epoxy mould compound (EMC) interface. A good understanding of factor effect on delamination factors will help to drive improvements on design and process optimization to minimize delamination concern. In this study, simulations are conducted to investigate effects of V-groove angle, depth and location on delamination propagation at the leadframe (LF)/EMC interface, indicating that smaller V-groove angle together with deeper V-groove and V- groove located far away from body edge can help reduce risk of delamination propagation. However it can also trigger other concerns, like crack near V-groove tip and difficulty in leadframe manufacturing. Therefore, V-groove design has to be optimized to achieve delamination requirement, and also fulfill process specification in the assembly line and capability of leadframe suppliers. This study demonstrates simulation driven development on delamination improvement.