Impact of interface traps on the BTBT-current in tunnel field effect transistors

M. Ehteshamuddin, Abdullah G. Alharbi, S. Loan
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引用次数: 11

Abstract

In this paper, we analyze the susceptibility of the Band-to-Band tunneling (BTBT) current subjected to the interface traps in silicon tunnel field effect transistors (TFET). The study quantifies the BTBT current against the types of interface traps (donor or acceptor), its density (NtD or NtA), and the corresponding trap energy level (Etrap) within the forbidden gap. It is observed that the acceptor-type traps deteriorate the BTBT mechanism in an n-TFET while it improves the same in a p-TFET. A similar, however, opposite observation is obtained for the donor-type traps. Further, it is observed that a small trap density (1×1011 cm−3) has little impact on the BTBT (due to large band-gap in silicon) while a larger value (5×1012 cm−3) changes the BTBT substantially. Moreover, it is shown that the trap energy location (Etrap =3D 1.0 eV) increases BTBT when closer to the conduction band for n-TFET while for p- TFET, a similar observation is made when Etrap is located closer to the valence band.
界面陷阱对隧道场效应晶体管中btbt电流的影响
本文分析了硅隧道场效应晶体管(ttfet)中受界面陷阱影响的带对带隧道电流的敏感性。该研究根据界面陷阱的类型(施主或受主)、其密度(NtD或NtA)以及禁隙内相应的陷阱能级(Etrap)来量化BTBT电流。观察到,受体型陷阱在n-TFET中恶化了BTBT机制,而在p-TFET中则改善了BTBT机制。然而,在供体型陷阱中得到了类似的相反的观察结果。此外,观察到小的陷阱密度(1×1011 cm−3)对BTBT的影响很小(由于硅中的带隙很大),而较大的陷阱密度(5×1012 cm−3)则会显著改变BTBT。此外,n-TFET的陷阱能量位置(Etrap =3D 1.0 eV)越靠近导带,BTBT就越高,而p- TFET的陷阱能量位置越靠近价带,BTBT也会增加。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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