Effects of atomic diffusion processes in Co-Cu multilayer granular films

Abstract

Co-Cu multilayer granular films deposited onto SiO₂/Si substrates have been submitted to thermal treatments in scanning mode. Their magnetisation, resistance and magnetoresistance have been studied after applying two different heating rates. The analysis of experimental data points out that only with the lower heating rate the properties of the films are strongly modified. In this case, indeed, XPS measurements show the presence of interdiffusion between atomic species of the substrate and metallic species inside the film. XPS data are presented to show the modifications in composition and chemical environment produced by thermal treatments.