Design of CMOS On-Chip Transformer Coupled Matching Network for Millimeter-Wave Amplifiers with Optimal Chip Area

M. S. Hossain, M. Fujishima, T. Yoshida, S. Amakawa, M. Rashid
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引用次数: 1

Abstract

Transformer coupled matching network is one of the alternative topologies for millimeter-wave integrated circuit design. Its impedance (inter-stage) transforming network (ITN) have been examined by planar and stacked topology with dimensional changing where planar transformer gives comparatively better performance than the stacked one. One-to-one-turn transformer-coupled ITN has been evaluated by the physical properties on optimum dimensional changing. Where ITN parameters and its properties function have been set below self-resonant frequencies (SRF) at 60 GHz & 79 GHz amplifiers. The quality factors (Qf)and insertion losses (IL)of transformer ITN are Qf@60GHz>20, insertion loss IL60GHz<4dB and Qf@79GHz>22, IL79GHz<3dB at their center frequency. Also, parasitic inter-winding capacitances between primary and secondary coil are minimum because of the phasor angle between these two-coil voltage goes near to 0°. At millimeter-wave, the parasitic resistances of transformer coupled ITN are coming down <3Ω form tee-type equivalent circuits of impedance matrices. Extracted Optimal values of capacitances, resistances and inductances help to increase mutual coupling coefficient as well as a good quality factor. Proposed planar and stacked small transformers have been utilized on ITN matching section of two millimeter-wave amplifiers on 55nm CMOS process. Supplying with 0.9V, mm-wave transformer coupled amplifiers have been designed layout area to 0.77 mm2 with 34.51 dB peak gain at 60 GHz and 0.46 mm2 with 17.15dB peak gain and both contain 24GHz 3dB bandwidth. As a result, it is confirmed that transformer coupled planar and modified stacked transformer are effective for shrinking layout area and high gain wideband 3dB BW in millimeter-wave regime.
芯片面积最优的毫米波放大器CMOS片上变压器耦合匹配网络设计
变压器耦合匹配网络是毫米波集成电路设计的备选拓扑之一。采用平面和堆叠拓扑对其阻抗(级间)变换网络(ITN)进行了研究,其中平面变压器的性能优于堆叠变压器。用最佳尺寸变化的物理性质评价了一对一匝变压器耦合ITN。其中,ITN参数及其特性函数已设置在60 GHz和79 GHz放大器的自谐振频率(SRF)以下。变压器ITN的质量因子(Qf)和插入损耗(IL) Qf@60GHz>20,中心频率处的插入损耗IL60GHz22、IL79GHz<3dB。此外,初级和次级线圈之间的寄生绕组间电容最小,因为这两个线圈电压之间的相量角接近0°。在毫米波下,变压器耦合ITN的寄生电阻从阻抗矩阵的t型等效电路中下降<3Ω。提取电容、电阻和电感的最优值有助于提高互耦系数和良好的品质因数。在55nm CMOS工艺的两个毫米波放大器的ITN匹配部分,采用了平面和堆叠型小型变压器。提供0.9V电源的毫米波变压器耦合放大器的设计布局面积为0.77 mm2, 60 GHz时峰值增益为34.51 dB,峰值增益为0.46 mm2,峰值增益为17.15dB,两者都包含24GHz 3dB带宽。结果表明,变压器耦合平面和改进的堆叠变压器对于缩小布局面积和毫米波波段的高增益宽带3dB BW是有效的。
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