Challenges and best practices in advanced silicon debug

Jing Zeng
{"title":"Challenges and best practices in advanced silicon debug","authors":"Jing Zeng","doi":"10.1109/TEST.2011.6139193","DOIUrl":null,"url":null,"abstract":"Which is better for the debug of root causes for post-silicon issues with functionality, performance, or power: functional test on ATE, system-level test, or structural test? The panel will discuss pros and cons of the different approaches. Functional or system tests have traditionally been used for debugging functionality, performance and power related issues for high performance microprocessors or complex Systems-on-Chip. The functional approach can be expensive in infrastructure investment and in resources. Much of the infrastructure may not be usable from product to product. Results may not provide all the information for an effective post-silicon design optimization strategy. Structural tests such as scan or different forms of BIST can provide greater coverage, but does not know if a design is correct. Scan-based tests can be used for performance debug and is easier to automate. Scan takes advantage of existing architectures in a design and the automated test pattern generation process. Due to the limited number of at-speed capture cycles, scan tests can be easier to debug as more information of the chip behavior at the point of failure is available. However, scan can also test non-functional paths or easily generate over-kill or over stress conditions. How can scan be used if it can cause a false performance issue? Diagnosing power related issues can be a complex problem. Besides characterizing the power consumption during system testing, parametric tests and test-structure assisted test-based learning often could provide a quick read into potential power issues. The panel will analyze pro's and con's of various types and combinations of advance silicon debug to highlight the challenges and best practices available. Panelists represent years of experience in Silicon debug in Chip, Board, and System test and debug as well as EDA.","PeriodicalId":6403,"journal":{"name":"2007 IEEE International Test Conference","volume":"26 1","pages":"1"},"PeriodicalIF":0.0000,"publicationDate":"2011-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 IEEE International Test Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TEST.2011.6139193","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

Which is better for the debug of root causes for post-silicon issues with functionality, performance, or power: functional test on ATE, system-level test, or structural test? The panel will discuss pros and cons of the different approaches. Functional or system tests have traditionally been used for debugging functionality, performance and power related issues for high performance microprocessors or complex Systems-on-Chip. The functional approach can be expensive in infrastructure investment and in resources. Much of the infrastructure may not be usable from product to product. Results may not provide all the information for an effective post-silicon design optimization strategy. Structural tests such as scan or different forms of BIST can provide greater coverage, but does not know if a design is correct. Scan-based tests can be used for performance debug and is easier to automate. Scan takes advantage of existing architectures in a design and the automated test pattern generation process. Due to the limited number of at-speed capture cycles, scan tests can be easier to debug as more information of the chip behavior at the point of failure is available. However, scan can also test non-functional paths or easily generate over-kill or over stress conditions. How can scan be used if it can cause a false performance issue? Diagnosing power related issues can be a complex problem. Besides characterizing the power consumption during system testing, parametric tests and test-structure assisted test-based learning often could provide a quick read into potential power issues. The panel will analyze pro's and con's of various types and combinations of advance silicon debug to highlight the challenges and best practices available. Panelists represent years of experience in Silicon debug in Chip, Board, and System test and debug as well as EDA.
高级硅调试中的挑战和最佳实践
对于功能、性能或电源的后硅问题的根本原因的调试,哪个更好:ATE上的功能测试、系统级测试,还是结构测试?小组将讨论不同方法的优缺点。功能或系统测试传统上用于调试高性能微处理器或复杂的片上系统的功能、性能和电源相关问题。功能方法在基础设施投资和资源方面可能代价高昂。许多基础设施可能无法从一个产品到另一个产品使用。结果可能无法为有效的后硅设计优化策略提供所有信息。结构测试,如扫描或不同形式的BIST可以提供更大的覆盖率,但不知道设计是否正确。基于扫描的测试可用于性能调试,并且更容易实现自动化。Scan在设计和自动化测试模式生成过程中利用了现有的体系结构。由于高速捕获周期的数量有限,扫描测试可以更容易地调试,因为可以获得更多的芯片在故障点的行为信息。然而,扫描也可以测试非功能路径或容易产生过度杀伤或过度压力条件。如果扫描可能导致错误的性能问题,该如何使用它?诊断与电源相关的问题可能是一个复杂的问题。除了描述系统测试期间的功耗外,参数测试和测试结构辅助的基于测试的学习通常可以快速了解潜在的功耗问题。该小组将分析各种类型和先进硅调试组合的优缺点,以突出挑战和最佳实践。小组成员在芯片、电路板和系统测试和调试以及EDA方面具有多年的硅调试经验。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信