Automated Reel-to-Reel Fluidic Self-Assembly for the Production of Solid State Lighting Modules

Se‐Chul Park, Jun Fang, Shantonu Biswas, Mahsa Mozafari, T. Stauden, H. Jacobs
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Abstract

We report the implementation of an automated reel-to-reel fluidic self-assembly system based on surface-tension driven self-assembly for macroelectronics application. The reported system incorporates precisely controlled and automated agitation, web moving, component recycling, and dispensing system. The system enables continuous parallel assembly of semiconductor chips at a high rate (15,000 chips per hour using 2.5 cm wide web) and assembly yield (>99%) under optimal condition. In principle, scaling to any throughput should be possible considering the parallel nature of self-assembly. The process overcomes the limitations on area and throughput of prior methods. It provides a new platform for macroelectronics to enable the integration of microscopic high performance inorganic semiconductors on flexible substrates with any desired location, pitch, and integration density. As an example we demonstrate the fabrication of a solid state area lighting module.
用于生产固态照明模块的自动卷到卷流体自组装
我们报道了一种基于表面张力驱动自组装的自动化卷轴到卷轴流体自组装系统的实现。报告的系统包括精确控制和自动搅拌,卷筒网移动,组件回收和分配系统。该系统能够在最佳条件下以高速率(使用2.5厘米宽的网每小时15,000个芯片)和组装良率(>99%)连续并行组装半导体芯片。原则上,考虑到自组装的并行特性,扩展到任何吞吐量都是可能的。该工艺克服了现有方法在面积和吞吐量上的限制。它为宏观电子学提供了一个新的平台,可以将微观高性能无机半导体集成到具有任何所需位置,间距和集成密度的柔性衬底上。作为一个例子,我们展示了一个固态区域照明模块的制造。
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