Recent progress of the p-type oxide thin films for transistor applications: Nickel oxide, Tin oxide, and Copper oxide

Minki Choe, Dahui Jeon, Inhong Hwang, I. Baek
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Abstract

Over the past decade, many research groups have been striving to develop high-performance p-type switching oxide materials for implementing complementary metal–oxide–semiconductor (CMOS) thin film devices. However, realizing p-type oxide thin film transistors (TFTs) whose electrical properties are comparable to n-type oxide TFTs has been challenging. This is because of inherent characteristics of p-type oxide materials such as the high formation energy of native acceptors and high hole effective mass caused by localized hole transport path. Developing a p-type oxide with a delocalized hole transport pathway and low hole formation energy is crucial for the production of CMOS circuits utilizing oxide thin films. NiO, SnO, and CuOx are being actively studied as candidate materials that satisfy these requirements. This review discusses the latest advances in the synthesis method of p-type binary oxide thin films and the approach for electrical performance enhancement.
晶体管用p型氧化物薄膜的最新进展:氧化镍、氧化锡和氧化铜
在过去的十年中,许多研究小组一直在努力开发高性能的p型开关氧化物材料,以实现互补金属氧化物半导体(CMOS)薄膜器件。然而,实现与n型氧化物薄膜晶体管电性能相当的p型氧化物薄膜晶体管(TFTs)一直是一个挑战。这是由于p型氧化物材料固有的特性,如原生受体的高形成能和局域化空穴输运路径导致的高空穴有效质量。开发具有离域空穴传输路径和低空穴形成能量的p型氧化物对于利用氧化物薄膜生产CMOS电路至关重要。NiO、SnO和CuOx作为满足这些要求的候选材料正在积极研究中。本文综述了p型二元氧化物薄膜的合成方法和电性能增强途径的最新进展。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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