Atomristors: Non-Volatile Resistance Switching in 2D Monolayers

Xiaohan Wu, Ruijing Ge, Myungsoo Kim, D. Akinwande, Jack C. Lee
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引用次数: 2

Abstract

Since the discovery of graphene, two-dimensional (2D) materials have drawn much attention as a promising candidate in the next-generation electron devices, optoelectronics and bioelectronics1, 2. Over the last few years, researchers have proved the existence of the non-volatile resistance switching (NVRS) behavior in various 2D materials, including graphene oxide, functionalized MoS2, partially degraded black phosphorus and multi-layer hexagonal boron-nitride (h-BN), etc.3–6, where the resistance can be switched between a high-resistance state (HRS) and a low-resistance state (LRS) and maintained for a long time without power supply 7. In 2015, Sangwan et al. discovered that grain boundaries in single-layer MoS2 can produce NVRS based on planar (horizontal) structure8. However, the planar structure without 3D stacking ability has the limitation of low integration density. Therefore, to overcome vertical scaling obstacle in NVRS based on conventional metal-insulator-metal (MIM) structure, it is desired to find out the thinnest materials that can produce the resistance switching behavior based on vertical device structure. Recently, we discovered that NVRS phenomenon is accessible in a variety of single-layer transition metal dichalcogenides (TMDs) and single-layer h-BN in vertical MIM configuration9–12. Compared with other 2D material-based NVRS devices, single-layer h-BN has only one atomic layer and ∼0.33 nm in thickness, which is the thinnest active layer in non-volatile resistance memory. These devices can be collectively labelled as “atomristor”, which means the memristor effect in atomically thin nanomaterials. The TMDs and h-BN atomristors have been studied using a crossbar or a litho-free & transfer-free structure, demonstrating forming-free switching with large on/off ratio (up to 6 orders of magnitude) and low switching voltage (down to < 1V). In addition, the devices are proved via pulse operation with fast switching speed (< 15 ns), which is comparable to the state-of-the-art speed in 2D memristors. The non-volatile RF switches based on h-BN atomristors are realized with low insertion loss (< 0.2 dB) and high isolation (> 15 dB) up to 100 GHz. The operating frequencies cover the RF, 5G, and mm-wave bands, making this a promising low-power switch for diverse communication and connectivity front-end systems. The results of this work indicate a potential universal resistive switching behavior in 2D monolayers, which is applicable to memory technology, neuromorphic computing, RF switch and flexible electronics.
原子电阻器:二维单层的非挥发性电阻开关
自石墨烯发现以来,二维(2D)材料作为下一代电子器件、光电子学和生物电子学的有前途的候选材料受到了广泛关注1,2。在过去的几年里,研究人员已经证明了各种二维材料(包括氧化石墨烯、功能化二硫化钼、部分降解黑磷和多层六方氮化硼(h-BN)等)中存在非挥发性电阻切换(NVRS)行为,其中电阻可以在高电阻状态(HRS)和低电阻状态(LRS)之间切换,并在没有电源的情况下长时间保持7。2015年,Sangwan等人发现单层二硫化钼的晶界可以产生基于平面(水平)结构的NVRS 8。但是,不具备三维叠加能力的平面结构存在集成密度低的局限性。因此,为了克服基于传统金属-绝缘子-金属(MIM)结构的NVRS的垂直结垢障碍,需要找到能够产生基于垂直器件结构的电阻开关行为的最薄材料。最近,我们发现在垂直MIM结构中,各种单层过渡金属二硫族化物(TMDs)和单层h-BN中都可以出现NVRS现象9 - 12。与其他基于2D材料的NVRS器件相比,单层h-BN只有一个原子层,厚度约0.33 nm,是非易失性电阻存储器中最薄的有源层。这些器件可以统称为“原子电阻”,这意味着在原子薄的纳米材料中的忆阻效应。采用交叉杆或无晶片和无转移结构研究了TMDs和h-BN原子电阻,证明了具有大开/关比(高达6个数量级)和低开关电压(低至< 1V)的无形成开关。此外,该器件通过脉冲操作证明具有快速开关速度(< 15 ns),可与2D记忆电阻器的最先进速度相媲美。基于h-BN原子电阻的非易失性射频开关具有低插入损耗(< 0.2 dB)和高隔离(> 15 dB),最高可达100 GHz。工作频率涵盖RF, 5G和毫米波频段,使其成为一种有前途的低功耗开关,适用于各种通信和连接前端系统。这项工作的结果表明,在二维单层中具有潜在的通用电阻开关行为,可用于存储技术,神经形态计算,射频开关和柔性电子。
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