W. Hsieh, A. Lyons, E. Pop, P. Keblinski, D. Cahill
{"title":"Pressure tuning of the thermal conductance of weak interfaces","authors":"W. Hsieh, A. Lyons, E. Pop, P. Keblinski, D. Cahill","doi":"10.1103/physrevb.84.184107","DOIUrl":null,"url":null,"abstract":"Wen-Pin Hsieh,1,2,* Austin S. Lyons,3,4 Eric Pop,3,4,5 Pawel Keblinski,6 and David G. Cahill2,7 1Department of Physics, University of Illinois, Urbana, Illinois 61801, USA 2Frederick-Seitz Materials Research Laboratory, University of Illinois, Urbana, Illinois 61801, USA 3Micro and Nanotechnology Lab, University of Illinois, Urbana, Illinois 61801, USA 4Department of Electrical and Computer Engineering, University of Illinois, Urbana, Illinois 61801, USA 5Beckman Institute, University of Illinois, Urbana, Illinois 61801, USA 6Department of Materials Science and Engineering, Rensselaer Polytechnic Institute, Troy, New York 12180, USA 7Department of Materials Science and Engineering, University of Illinois, Urbana, Illinois 61801, USA (Received 1 October 2011; published 16 November 2011)","PeriodicalId":9375,"journal":{"name":"Bulletin of the American Physical Society","volume":"126 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2011-11-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"80","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Bulletin of the American Physical Society","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1103/physrevb.84.184107","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 80
Abstract
Wen-Pin Hsieh,1,2,* Austin S. Lyons,3,4 Eric Pop,3,4,5 Pawel Keblinski,6 and David G. Cahill2,7 1Department of Physics, University of Illinois, Urbana, Illinois 61801, USA 2Frederick-Seitz Materials Research Laboratory, University of Illinois, Urbana, Illinois 61801, USA 3Micro and Nanotechnology Lab, University of Illinois, Urbana, Illinois 61801, USA 4Department of Electrical and Computer Engineering, University of Illinois, Urbana, Illinois 61801, USA 5Beckman Institute, University of Illinois, Urbana, Illinois 61801, USA 6Department of Materials Science and Engineering, Rensselaer Polytechnic Institute, Troy, New York 12180, USA 7Department of Materials Science and Engineering, University of Illinois, Urbana, Illinois 61801, USA (Received 1 October 2011; published 16 November 2011)
谢文平，1,2，* Austin S. Lyons,3,4 Eric Pop,3,4,5 Pawel Keblinski,6 and David G. cahill2,7 1伊利诺伊大学物理系，美国伊利诺伊州厄巴纳61801 2伊利诺伊大学frederick - seitz材料研究实验室，美国伊利诺伊州厄巴纳61801 3伊利诺伊大学微与纳米技术实验室，美国伊利诺伊州厄巴纳61801 4伊利诺伊大学电气与计算机工程系，美国伊利诺伊州厄巴纳61801 5贝克曼研究所，美国伊利诺伊州厄巴纳6伊利诺伊大学材料科学与工程系，伦斯勒理工学院，纽约，12180;7伊利诺伊大学材料科学与工程系，伊利诺伊，厄巴纳，61801，美国(获于2011年10月1日;2011年11月16日出版)
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