High-bandwidth IC interconnects with silicon interposers and bridges for 3D multi-chip integration and packaging

Abstract

Silicon interposer and bridge is a multi-chip 3D technology that enables high density die-to-die interconnect on a package substrate. It opens a new era for heterogeneous on-package system integration. This paper presents an overview of this packaging architecture and its capabilities from concept to results. The overall components are introduced and discussed including constituent building blocks, embedded elements and structures, die-to-package connections. The high bandwidth signaling performance is analyzed and quantified by using high frequency electromagnetic modeling and full-wave simulation approaches. The inherent cost benefit and advantages, such as scaling and extensibility of this technology, are highlighted among other competing technologies. The assembly process is described in the end at a high level.