Session 1 Overview Plenary Session - Invited Papers

Kevin Zhang, M. Ikeda
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Abstract

The Plenary Session will begin with welcome remarks, and an introduction from the Conference Chair, Jan van der Spiegel. Then, Eugenio Cantatore, the Technical Program Chair, will provide an overview of ISSCC 2019. Next, the Plenary Session will feature four keynote speakers, who are renowned leaders in their respective fields. In line with the Conference theme, “Envisioning the Future”, they will overview important innovation trends that are predicted to have a strong impact on the further development of Integrated circuits and systems: Artificial Intelligence (AI) and Machine Learning (ML), integration of photonics and electronics, and 5G. An Awards Ceremony that recognizes major technical and professional accomplishments, presented by the IEEE, Solid-State-Circuits Society (SSCS), and ISSCC, will take place following the second plenary talk. plenaries as local learning and brain-mimicking functions) are addressed. The next two plenary talks focus on the future of communication technologies: The integration of photonic functions in photonic chips, and the creation of new systems that put together integrated electronics and photonics is one of the most compelling emerging technologies today. Meint Smit, Professor of Photonic Integration at the Eindhoven University of Technology, provides an overview of the state-of-the-art in InP- and Si-based photonics, reviewing similarities and differences, and discussing in detail membrane-based InP photonic technologies supporting efficient integration with electronics. is human-human inflection is and key the disruptive architectures and technology innovations of plenary personal of the motivating be the two horses driving the carriage called AI, thus opening up new requirements for the next generation deep learning SoCs. The application market for Photonic Integrated Circuits (PICs) is rapidly growing. Photonic Integration is the dominant technology in high bandwidth communications and is set to become dominant in many fields of photonics, just like microelectronics in the field of electronics. Photonic integrated circuits offer compelling performance advances in terms of precision, bandwidth and energy efficiency. To enable uptake in new sectors, the availability of highly standardized (generic) photonic integration platform technologies is of key importance as this separates design from technology, reducing barriers for new entrants. The major platform technologies today are InP-based monolithic integration and Silicon Photonics. In this perspective paper we will describe the current status and future developments of InP-based generic integration platforms. The 5G era is upon us, ushering in new opportunities for technology innovation across the computing and connectivity landscape. 5G presents an inflection point where wireless communication technology is driven by application and expected use cases, and where the network will set the stage for data-rich services and sophisticated cloud apps, delivered faster and with lower latency. This paper will highlight the disruptive architectures and technology innovations required to make 5G and beyond a reality.
全体会议-邀请论文
全体会议将以欢迎辞开始,并由会议主席扬·范德斯皮格尔作介绍。随后,技术项目主席Eugenio Cantatore将对ISSCC 2019进行概述。接下来,全体会议将有四位主题演讲嘉宾,他们都是各自领域的知名领袖。根据会议主题“展望未来”,他们将概述预计将对集成电路和系统的进一步发展产生重大影响的重要创新趋势:人工智能(AI)和机器学习(ML),光子学和电子学的集成以及5G。由IEEE、固态电路学会(ssc)和ISSCC颁发的表彰主要技术和专业成就的颁奖典礼将在第二次全体会议之后举行。全会作为局部学习和大脑模仿功能)。接下来的两个全体会议将重点讨论通信技术的未来:光子芯片中光子功能的集成,以及将集成电子和光子学结合在一起的新系统的创建是当今最引人注目的新兴技术之一。埃因霍温理工大学光子集成教授Meint Smit概述了基于InP和si的光子学的最新进展,回顾了异同,并详细讨论了支持与电子器件高效集成的膜基InP光子技术。是人与人的转折,关键是颠覆性的架构和技术创新的全体个人的激励是两匹马驱动的马车称为人工智能,从而开辟了新的要求下一代深度学习soc。光子集成电路(PICs)的应用市场正在迅速增长。光子集成是高带宽通信的主导技术,并将在光子学的许多领域占据主导地位,就像微电子在电子学领域一样。光子集成电路在精度、带宽和能量效率方面提供了令人信服的性能进步。为了使新领域能够吸收,高度标准化(通用)光子集成平台技术的可用性至关重要,因为这将设计与技术分离开来,减少了新进入者的障碍。目前主要的平台技术是基于inp的单片集成和硅光子学。在这篇前瞻性的文章中,我们将描述基于inp的通用集成平台的现状和未来的发展。5G时代即将到来,为计算和连接领域的技术创新带来了新的机遇。5G提供了一个拐点,无线通信技术由应用和预期用例驱动,网络将为数据丰富的服务和复杂的云应用奠定基础,提供更快、更低延迟的服务。本文将重点介绍使5G及其以后成为现实所需的颠覆性架构和技术创新。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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