Thermo-Mechanical Test of SnBi and SnCu Solder Joints on Different Surface Finishes

2019 42nd International Spring Seminar on Electronics Technology (ISSE) Pub Date : 2019-05-15 DOI:10.1109/ISSE.2019.8810299

D. Bušek, K. Dušek, T. Beran, P. Veselý

{"title":"Thermo-Mechanical Test of SnBi and SnCu Solder Joints on Different Surface Finishes","authors":"D. Bušek, K. Dušek, T. Beran, P. Veselý","doi":"10.1109/ISSE.2019.8810299","DOIUrl":null,"url":null,"abstract":"The article deals with the heating factor influence on the solder joint reliability. A specific goal was to reveal the influence of the heating factor on the thickness of the Intermetallic Layer (IML)for Copper, Electroless Nickel Immersion Gold (ENIG)and Hot Air Solder Levelling (HASL)surface finishes and two lead free solders Sn42Bi58 and Sn99.3CuO. 7. Three different heating factors were used for hot air reflow of the Bismuth solder paste and another three for reflow of the SnCu solder paste. Micro-sections were prepared and the IMC (Inter-Metallic Compound)layer thickness was measured. The manufactured samples were subjected to destructive shear strength testing at laboratory temperature (20 °C)and at 65 °C. The results show an influence of intermetallic layer thickness on the shear strength and a minor decrease of the shear strength at elevated testing temperature for a low temperature Bismut based solder paste. When SnCu solder was used, the IMC layer was thicker and also the shear strength was lower, in an average (on all surface finishes)by 19%.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"31 1","pages":"1-4"},"PeriodicalIF":0.0000,"publicationDate":"2019-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSE.2019.8810299","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 3

Abstract

The article deals with the heating factor influence on the solder joint reliability. A specific goal was to reveal the influence of the heating factor on the thickness of the Intermetallic Layer (IML)for Copper, Electroless Nickel Immersion Gold (ENIG)and Hot Air Solder Levelling (HASL)surface finishes and two lead free solders Sn42Bi58 and Sn99.3CuO. 7. Three different heating factors were used for hot air reflow of the Bismuth solder paste and another three for reflow of the SnCu solder paste. Micro-sections were prepared and the IMC (Inter-Metallic Compound)layer thickness was measured. The manufactured samples were subjected to destructive shear strength testing at laboratory temperature (20 °C)and at 65 °C. The results show an influence of intermetallic layer thickness on the shear strength and a minor decrease of the shear strength at elevated testing temperature for a low temperature Bismut based solder paste. When SnCu solder was used, the IMC layer was thicker and also the shear strength was lower, in an average (on all surface finishes)by 19%.

查看原文本刊更多论文

不同表面处理下SnBi和SnCu焊点的热力学试验

本文讨论了加热因素对焊点可靠性的影响。具体目标是揭示加热因子对铜、化学镍浸金(ENIG)和热风整平(HASL)表面处理和两种无铅焊料Sn42Bi58和Sn99.3CuO的金属间层(IML)厚度的影响。7. 用三种不同的加热因素对铋锡膏进行热风回流，用另外三种加热因素对SnCu锡膏进行热风回流。制备了显微切片，测量了金属间化合物(IMC)层厚度。制造的样品在实验室温度(20°C)和65°C下进行破坏性剪切强度测试。结果表明，金属间层厚度对低温铋基锡膏的抗剪强度有影响，升高测试温度时锡膏的抗剪强度略有下降。当使用SnCu焊料时，IMC层更厚，抗剪强度也更低，平均(在所有表面处理)降低19%。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

2019 42nd International Spring Seminar on Electronics Technology (ISSE)

自引率

0.00%

发文量