Evaluation of adhesion materials for gold line-and-space surface plasmon antenna on SOI-MOS photodiode

Abstract

In order to improve the light sensitivity of silicon-on-insulator metal-insulator-semiconductor (SOI-MOS) photodiode, differences caused by the adhesion materials for gold (Au) line-and-space (L/S) surface plasmon (SP) antenna are evaluated based on the electromagnetic simulation. Furthermore, the rejection ratio for polarized light with silicon nitride (Si3N4) adhesion layer is analyzed.