Impact of Etching Time on Ideality Factor and Dynamic Resistance of Porous Silicon Prepared by Electrochemical Etching (ECE)

H. Hadi
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引用次数: 5

Abstract

In this work, porous silicon layers were fabricated on p-type crystalline silicon wafers using electrochemical etching ECE process. Al films were deposited onto porous layer /Si wafers by thermal evaporation to form rectifying junction. An investigation of the dependence on applied etching time to formed PS layer was studied. Effect etching time on the electrical properties of porous silicon is checked using Current–voltage I–V characteristics. The ideality factor and dynamic resistances are found to be large than the one and 20 (kΩ) respectively by the analysis of the dark I–V characteristics of Al/PS/p-Si heterojunction.
蚀刻时间对电化学蚀刻多孔硅理想系数和动态电阻的影响
本文采用电化学蚀刻ECE工艺在p型晶硅片上制备了多孔硅层。通过热蒸发将Al薄膜沉积在多孔硅/层晶片上形成整流结。研究了施加蚀刻时间对形成PS层的影响。利用电流-电压I-V特性考察了蚀刻时间对多孔硅电学性能的影响。通过分析Al/PS/p-Si异质结的暗I-V特性,发现其理想因数和动态电阻分别大于1和20 (kΩ)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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