{"title":"Simulation-Based Optimization of Injection Molding Process Parameters for Minimizing Warpage by ANN and GA","authors":"Chiwapon Nitnara, Kumpon Tragangoon","doi":"10.14716/ijtech.v14i2.5573","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":50285,"journal":{"name":"International Journal of Technology Management","volume":null,"pages":null},"PeriodicalIF":1.4000,"publicationDate":"2023-04-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Technology Management","FirstCategoryId":"91","ListUrlMain":"https://doi.org/10.14716/ijtech.v14i2.5573","RegionNum":4,"RegionCategory":"管理学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, MULTIDISCIPLINARY","Score":null,"Total":0}
期刊介绍:
The IJTM aims to provide a refereed and authoritative source of information in the field of managing with technology, and the management of engineering, science and technology. It seeks to establish channels of communication between government departments, technology executives in industry, commerce and related business, and academic experts in the field.