Yield Enhancement by Virtual Fabrication: Using Failure Bin Classification, Yield Prediction and Process Window Optimization to Identify and Prevent Process Failures
Qingpeng Wang, Yu De Chen, Jacky Huang, Wuping Liu, Ervin Joseph
{"title":"Yield Enhancement by Virtual Fabrication: Using Failure Bin Classification, Yield Prediction and Process Window Optimization to Identify and Prevent Process Failures","authors":"Qingpeng Wang, Yu De Chen, Jacky Huang, Wuping Liu, Ervin Joseph","doi":"10.1109/CSTIC49141.2020.9282443","DOIUrl":null,"url":null,"abstract":"This paper provides an example of yield enhancement using virtual fabrication. A 6 transistors based static random access memory example on 7nm node technology was used in this case study. Yield loss caused by via contact-metal edge placement error was modeled and analyzed. The results show that yield can be enhanced from 48.4% to 99.0% through process window optimization and improved specification control. We identified high resistance failure as the top failure mode in both non-optimized and optimized process models.","PeriodicalId":6848,"journal":{"name":"2020 China Semiconductor Technology International Conference (CSTIC)","volume":"19 1","pages":"1-3"},"PeriodicalIF":0.0000,"publicationDate":"2020-06-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 China Semiconductor Technology International Conference (CSTIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CSTIC49141.2020.9282443","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
This paper provides an example of yield enhancement using virtual fabrication. A 6 transistors based static random access memory example on 7nm node technology was used in this case study. Yield loss caused by via contact-metal edge placement error was modeled and analyzed. The results show that yield can be enhanced from 48.4% to 99.0% through process window optimization and improved specification control. We identified high resistance failure as the top failure mode in both non-optimized and optimized process models.