Overview and innovations in LTCC manufacturing for 3D, sensors and MEMS applications

Abstract

An overview of the state of the art LTCC process, technology and its applications will be presented. LTCC integrated electronic circuit technology is currently developing rapidly into new areas. Well known for its robustness and suitability for high frequency circuits, LTCC is now developing into new applications such as MEMS sensors and actuators. New possibilities are created by 3D fluidic integration for sensors and micro reactors. With ever increasing requirements for miniaturisation, optimized processing methods have been developed. The new LTCC processing methods enable higher accuracies of the produced parts while facilitating the incorporation of 3D channels in production environments. The higher accuracy methods however also put constraints on the properties of the materials used making it necessary to choose the correct process and material for its application.