Theoretical Study of a Thermophysical Property of Molten Semiconductors

Fathi Aqra, A. Ayyad
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引用次数: 4

Abstract

This paper deals with theoretical approach to surface tension of molten silicon and germanium, and contributes to this field, which is very important. A theoretical calculation for determining the surface tension of high-temperature semiconductor melts, such as molten silicon and germanium, in the temperature range 1687–1825 K and 1211–1400 K, respectively, is described. The calculated temperature-dependence surface tension data for both Si and Ge are expressed as 𝛾=876−0.32(𝑇−𝑇𝑚) and 𝛾=571−0.074(𝑇−𝑇𝑚) (mJ m−2), respectively. These values are in consistence with the reported experimental data (720–875 for Si and 560–632 mJ m−2 for Ge). The calculated surface tension for both elements decreases linearly with temperature.
熔融半导体热物理性质的理论研究
本文探讨了硅锗熔液表面张力的理论方法,为这一领域的研究做出了重要贡献。本文描述了在1687 ~ 1825 K和1211 ~ 1400 K温度范围内测定硅和锗等高温半导体熔体表面张力的理论计算。计算得到的Si和Ge的表面张力随温度变化的数据分别为: =876−0.32(𝑇−𝑇𝑚)和 =571−0.074(𝑇−𝑇𝑚)(mJ m−2)。这些值与报道的实验数据一致(Si为720-875,Ge为560-632 mJ m−2)。计算得到的两种元件的表面张力随温度线性降低。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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