Cyclic stress—strain response of polycrystalline copper under fatigue conditions producing enhanced strain localization

Zhirui Wang, Campbell Laird
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引用次数: 74

Abstract

It is now established that the cyclic stress—strain curve of polycrystalline wavy slip metal, e.g. copper, does not contain a plateau if the tests are carried out in conventional strain control. Since fracture research indicates that such tests homogenize the strain, and tests initiated by ramp loading appear to give higher degrees of strain localization, an investigation of cyclic response has been made in polycrystalline copper using the ramp-start method. After specimens were ramped to a desired stress level, they were then tested in strain control. The results showed a plateau to occur at 98 MPa, which corresponds to the plateau shear stress for monocrystals corrected by the Taylor factor. Observations of persistent slip band behavior on the gage surfaces, and of the dislocation structures by transmission electron microscopy (TEM) support the existence of the plateau and demonstrate that it is associated with higher degrees of strain localization induced by starting the tests by ramp loading.

疲劳条件下多晶铜的循环应力-应变响应产生增强的应变局部化
现在已经确定,如果在常规应变控制中进行测试,多晶波滑金属(例如铜)的循环应力-应变曲线不包含平台。由于断裂研究表明,这种试验使应变均匀化,并且斜坡加载启动的试验似乎给出了更高程度的应变局部化,因此使用斜坡启动方法对多晶铜的循环响应进行了研究。在将样品倾斜到所需的应力水平后,进行应变控制测试。结果表明,在98 MPa时出现平台,对应于经泰勒因子校正的单晶的平台剪切应力。通过透射电子显微镜(TEM)观察到的测量表面持续的滑移带行为和位错结构支持了平台的存在,并证明它与斜坡加载开始试验时引起的更高程度的应变局部化有关。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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