Detection of Cu (I) in Copper Sulfate Plating Solution Using BCS Fluorescence

Abstract

We successfully detected unstable Cu (I) in copper sulfate plating solution using BCS fluorescence. Quantitative measurement at 10 mol/L or less, out of range with the conventional absorption method, was possible by the fluorescence method. The fluorescent method is promising for Cu (I) analysis in Cu electroplating solution to assure the quality of Cu plating film in higher sensitivity.