Testing high-frequency and low-power designs: Do the standard rules and tools apply?

S. Davidson
{"title":"Testing high-frequency and low-power designs: Do the standard rules and tools apply?","authors":"S. Davidson","doi":"10.1109/TEST.2012.6401529","DOIUrl":null,"url":null,"abstract":"The fast growing mobile market has led to a demand for low power ICs, in order to extend battery life and keep a phone from literally burning a hole in the user's pocket. The microprocessor and high-end System on a Chip field both have a demand for faster ICs. But this is not enough. Mobile devices want to be faster, and high-end devices want to be cooler, if possible. Designers have to be able to tradeoff these conflicting goals to produce products fast enough and cool enough (in both senses of that word) for the marketplace. DFT and test engineers have to deal with this new environment. They have to be able to determine if a particular part hits its speed goals. They have to be able to handle the problems arising from large amounts of switching. For low power parts they have to make sure that scan and BIST do not draw more power than the part can handle, and work around circuitry that turns off parts of the design not in use. Test EDA suppliers have to figure out ways of making their tools work for both high speed and low power designs, and how to help their customers make these nearly impossible tradeoffs. This panel explores these problems and their impact on EDA tools. Three test experts from the design world will answer questions on how they deal with the problems of low power and high speed designs posed by the moderator. Then two panelists from the test EDA sector will suggest how their tools can help — or admit that their tools need more work in that area. Then the discussion will be opened to the audience to allow them to give their solutions to these problems or to pose still tougher problems for us to solve.","PeriodicalId":6403,"journal":{"name":"2007 IEEE International Test Conference","volume":"19 1","pages":"1"},"PeriodicalIF":0.0000,"publicationDate":"2012-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 IEEE International Test Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TEST.2012.6401529","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

The fast growing mobile market has led to a demand for low power ICs, in order to extend battery life and keep a phone from literally burning a hole in the user's pocket. The microprocessor and high-end System on a Chip field both have a demand for faster ICs. But this is not enough. Mobile devices want to be faster, and high-end devices want to be cooler, if possible. Designers have to be able to tradeoff these conflicting goals to produce products fast enough and cool enough (in both senses of that word) for the marketplace. DFT and test engineers have to deal with this new environment. They have to be able to determine if a particular part hits its speed goals. They have to be able to handle the problems arising from large amounts of switching. For low power parts they have to make sure that scan and BIST do not draw more power than the part can handle, and work around circuitry that turns off parts of the design not in use. Test EDA suppliers have to figure out ways of making their tools work for both high speed and low power designs, and how to help their customers make these nearly impossible tradeoffs. This panel explores these problems and their impact on EDA tools. Three test experts from the design world will answer questions on how they deal with the problems of low power and high speed designs posed by the moderator. Then two panelists from the test EDA sector will suggest how their tools can help — or admit that their tools need more work in that area. Then the discussion will be opened to the audience to allow them to give their solutions to these problems or to pose still tougher problems for us to solve.
测试高频和低功耗设计:标准规则和工具适用吗?
快速增长的移动市场导致了对低功耗ic的需求,以延长电池寿命,防止手机在用户的口袋里烧出一个洞。微处理器和高端片上系统领域都对更快的集成电路有需求。但这还不够。如果可能的话,移动设备想要更快,高端设备想要更酷。设计师必须能够权衡这些相互冲突的目标,以便为市场提供足够快和足够酷的产品(在这个词的两个意义上)。DFT和测试工程师必须应对这种新的环境。他们必须能够确定某个特定部件是否达到了速度目标。他们必须能够处理大量切换所产生的问题。对于低功耗部件,他们必须确保扫描和BIST不会消耗超过部件可以处理的功率,并围绕关闭不使用的设计部分的电路工作。测试EDA供应商必须找出使他们的工具同时适用于高速和低功耗设计的方法,以及如何帮助他们的客户进行这些几乎不可能的权衡。本小组将探讨这些问题及其对EDA工具的影响。三位来自设计界的测试专家将回答主持人提出的如何处理低功耗和高速设计的问题。然后,来自测试EDA部门的两位小组成员将建议他们的工具如何提供帮助——或者承认他们的工具在该领域需要更多的工作。然后讨论将开放给观众,让他们给出他们对这些问题的解决方案,或者提出更棘手的问题让我们解决。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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