A 550μm2 CMOS temperature sensor using self-discharging P-N diode with ±0.1°C (3σ) calibrated and ±0.5°C (3σ) uncalibrated inaccuracies

Golam R. Chowdhury, A. Hassibi
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引用次数: 1

Abstract

This work presents a CMOS temperature sensor designed specifically for distributed thermal monitoring systems of high-performance system-on-chips (SoCs). The sensor uses the temperature-dependent reverse-bias current of a p-n diode to monitor on-chip thermal profile. It occupies a small footprint of 550μm2 in a 0.18μm process. The compact size of the sensor allows its usage as a “standard cell" at different on-chip coordinates to monitor localized heating due to potential hotspots on the SoC die. The sensor demonstrates measurement inaccuracies of ±0.1°C (3σ) with calibration, and +0.5°C (3σ) without any calibration, over 35°C-100°C measured temperature range. It consumes 4μW from a single 1.8V supply.
采用自放电P-N二极管的550μm2 CMOS温度传感器,校准误差为±0.1°C (3σ),未校准误差为±0.5°C (3σ)
本研究提出一种CMOS温度传感器,专为高性能片上系统(soc)的分布式热监测系统而设计。该传感器使用p-n二极管的温度相关反偏置电流来监测片上热分布。采用0.18μm工艺,占地面积仅为550μm2。传感器的紧凑尺寸允许其作为不同芯片上坐标的“标准单元”使用,以监测由于SoC芯片上潜在热点导致的局部加热。在35°C-100°C的测量温度范围内,该传感器在校准时的测量误差为±0.1°C (3σ),在没有任何校准的情况下的测量误差为+0.5°C (3σ)。它从单个1.8V电源消耗4μW。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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