Short Channel Effects Characterization of 3-D FinFET for High-k Gate Dielectrics

Zunaid Ahmed Zaki, Noshin Tanjila, J. K. Saha
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引用次数: 1

Abstract

In modern technology FinFET replaces MOSFET as aggressive technology scaling as per Moore's law has led to elevated power dissipation levels owing to short channel effects. In this research, we focused on different FinFET structures. We compared short channel effects, such as Ion/Ioff ratio, threshold voltage roll-off and subthreshold swing of Double gate FinFET (DGFinFET) and Tri-Gate FinFET (TGFinFET) for different high-k dielectric material. The structures were designed for 22 nm technology. Also, effect of different dielectric material on different underlap length of TGFinFET is discussed in our work.
用于高k栅极介质的三维FinFET短沟道效应表征
在现代技术中,FinFET取代了MOSFET,因为根据摩尔定律的积极技术缩放由于短通道效应导致功耗水平升高。在本研究中,我们重点研究了不同的FinFET结构。我们比较了不同高k介电材料下双门FinFET (DGFinFET)和三门FinFET (TGFinFET)的短通道效应,如离子/关断比、阈值电压滚降和亚阈值摆幅。结构设计为22纳米技术。本文还讨论了不同介电材料对TGFinFET不同搭接长度的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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