Numerical Simulation of Capillary and Fluid Dynamic Forces on Tiny Chips in Fluidic Self-Assembly Process

A. Tay, Hua Li, Xiangyang Gao, J. Chen, V. Kripesh
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引用次数: 2

Abstract

Fluidic self-assembly processes have been recently demonstrated to be a feasible method of assembling tiny chips in a cost-effective manner. In order to successfully implement the fluidic self-assembly process, it is important to quantify the magnitudes of the restoring capillary force and torque between the chip and the binding site and to determine the fluid dynamic forces acting on the chip as fluid flows over the chip. This paper presents results of numerical simulations of these restoring capillary forces and torques, and discusses the effect of various parameters on them, such as lubricant volume, component orientation and contact angle. The results show that the restoring forces in both lift and shift directions decrease significantly with the volume of lubricant. Analysis of the sensitivity of the restoring torque to the contact angle between the lubricant and the self-assembled monolayer (SAM) in water is also carried out. It is observed that, at smaller contact angles, the maximum torque is insensitive to the contact angle between 0 to 40deg. It thus suggests that a lubricant with a contact angle less than 40 degrees can be used without loss of effectiveness. The equilibrium of the chip under the action of flow-induced and capillary forces has also been analysed
流体自组装过程中微晶片毛细管力和流体动力的数值模拟
流体自组装工艺最近被证明是一种具有成本效益的组装微型芯片的可行方法。为了成功地实现流体自组装过程,重要的是量化芯片与结合位点之间的恢复毛细力和扭矩的大小,并确定流体流过芯片时作用在芯片上的流体动力学力。本文给出了这些恢复毛细力和扭矩的数值模拟结果,并讨论了润滑剂体积、部件取向和接触角等参数对它们的影响。结果表明,随着润滑油体积的增加,升力和位移方向的恢复力都显著减小。分析了恢复力矩对润滑油与水中自组装单层膜(SAM)接触角的敏感性。观察到,在较小的接触角下,最大转矩对0 ~ 40°的接触角不敏感。因此,可以使用接触角小于40度的润滑剂而不会失去效果。分析了流诱导力和毛细力作用下的切屑平衡
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